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Teledyne Advanced Electronic Solutions
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Automated Optical Inspection
Processes
Assembly Cleaning
Automated Optical Inspection
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BGA/Device Underfill
Bonding/Coating
Circuit Card Assembly
Component Placement
Material Dispensing
Pin Thru Hole Assembly
Reflow Soldering
Secondary Assembly
Solder Paste
Specialized Rework
X-Ray Inspection
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Teledyne EMS uses Automated Optical Inspection (AOI) on all SMT lines, before and after the reflow process
Pre-reflow AOI checks for presence, polarity and location of all SMT components for immediate feedback to the production line. Errors can be corrected before reflow to prevent rework and ensure subsequent assemblies are correct.
Post reflow AOI inspects the same parameters as pre-reflow as well as checking for solder defects, bridges, etc.
AOI data are retained for each assembly by serial number and reference designator
Images of each component can be retrieved to help determine the root cause of defects from inspection and test
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